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Solution to Microchip Overheating in Space Applications Drives Commercial Success

| AF SBIR/STTR | Aug. 1, 2017

ThermAvant Technologies LLC

  • LOCATION: Columbia, Missouri
  • TOPIC NUMBER: AF112-057
  • TOPIC TITLE: Next-Generation Microchip Carrier for Cooling of Satellite Payload Electronics
  • TECHNICAL PROJECT OFFICE: AFRL Space Vehicles Directorate, Kirtland AFB, NM

A new microchip cooling technology that paves the way for higher-performance electronics on spacecraft is spurring growth at a Missouri-based small business.

With support from the Air Force Small Business Innovation Research/Small Business Technology Transfer Program, ThermAvant Technologies successfully demonstrated advanced thermal management solutions for spacecraft electronics based on an emerging, but mostly untapped technology. Since its initial research project for the Air Force, the company has entered dozens of agreements to supply the solution for aerospace and defense applications.


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